Basic Information

Reference Number

0000279718

Issuing Organization

Simon Fraser University

Owner Organization

Simon Fraser University

Solicitation Type

RFP - Request for Proposal (Formal)

Solicitation Number

2024-PD-365

Title

PECVD System and Inductively Coupled Plasma Reactive Ion Etcher (ICP-RIE) system

Source ID

PU.AC.BC.836081.C83134

Agreement Types

Canada-European Union Comprehensive Economic and Trade Agreement(CETA)

Canadian Free Trade Agreement (CFTA)

New West Partnership Trade Agreement (NWPTA)

Details

Location

Canada, British Columbia, Lower Mainland-Southwest

Delivery Point

8888 University Drive
Burnaby, British Columbia
Canada V5A 1S6

Purchase Type

One Time Only- Delivery Date:2025/03/31

Description

Description of Deliverables

The RFP invites offers for the provision of the following equipment:

A Plasma Enhanced Chemical Vapor Deposition (PECVD) system for depositing silicon-based materials.
An Inductively Coupled Plasma Reactive Ion Etcher (ICP-RIE) for metal etching.

The proponent must be able to supply both items.

THE DELIVERABLES

4D LABS at Simon Fraser University is acquiring infrastructure to enable further development of quantum- and microsystems-based technologies. In particular, they are seeking the following:

PECVD (Plasma-Enhanced Chemical Vapor Deposition) system for deposition of silicon-based materials.
ICP-RIE (Inductively Coupled Plasma Reactive Ion Etching) system for etching of metals.

The tools will be housed in a class 100 Clean Room facility, alongside a variety of micro- and nanofabrication equipment.

Key requirements for the systems:

Designed for low-to-medium scale research and development.
Flexible systems to allow for a wide range of materials to be used.
Suitable for a multi-user facility with low service requirements.
Simple to operate.

Please include the following instrument requirements in the proposal:

Floor loading.
Electrical power supply (e.g., 208V or 120V).
Cooling (including pressure, flow, and heat load).
Exhaust.
Gases.

PECVD/ ICP-RIE Requirements:

Mandatory Specifications for PECVD and ICP-RIE

There is a basic configuration and performance specification that are mandatory. The proponent is to provide a quote for each item with these specifications in Appendix C – Rate Bid Form.

Optional Specifications for PECVD and ICP-RIE:

Includes additional features or capabilities that are desirable.
Will be considered in the value-added section.
Pricing should be provided separately in the Value-Add section of Appendix D.

Non-mandatory specifications: This configuration is for additional options and is part of the Value-Add section in Appendix D.

Dates

Publication

2024/10/04 09:52:10 PM PDT

Bid Intent

Not Available

Question Acceptance Deadline

2024/10/18 11:59:00 PM PDT

Questions are submitted online

Yes

Closing Date

2024/11/08 02:00:00 PM PST

Contact Information

Paul Dhaliwal

778-782-6840

paul_dhaliwal@sfu.ca

Bid Submission Process

Bid Submission Type

Electronic Bid Submission

Pricing

In attached document

Bid Documents List

Item Name	Description	Mandatory	Limited to 1 file
Appendix B	Submission Form	Yes	No
Appendix C	Rate Bid Form	Yes	No
Appendix D	Questions	Yes	No
No entries

Additional Bidding Instructions

Please make note of the following when preparing your proposals:

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