Basic Information

Reference Number

0000249819

Issuing Organization

The Winnipeg School Division No. 1

Project Type

RFP - Request for Proposal (Formal)

Project Number

476737

Title

Ecole Sir William Osler Addition & Renovation and Childcare

Source ID

PU.SC.MB.291511.C28420

Agreement Types

Canada-European Union Comprehensive Economic and Trade Agreement(CETA)

Canadian Free Trade Agreement (CFTA)

New West Partnership Trade Agreement (NWPTA)

Details

Location

Canada, Manitoba, Winnipeg

Job Location

1600 Grant Ave

Purchase Type

Duration: 21 month(s)

Description

MANDATORY SITE WALKTHROUGHS / PRE-SUBMISSION MEETINGS
have been scheduled as follows:
GENERAL CONTRACTORS ON WEDNESDAY, JUNE 21, 2023 AT 4:00 P.M.
at the location of Sir William Osler School, Outside of Main Entrance,
1600 Grant Ave., Winnipeg, MB.

General Contractors are required to attend in order to submit a valid response.

PROJECT DESCRIPTION
- Ecole Sir William Osler Addition & Renovation and Childcare - Generally Consists of (2) school additions, a Stand-alone Childcare building and site redevelopment, The School Addition & Renovation portion consists of a 2-Storey Classroom wing addition, a 1-Storey Gymnasium addition, select renovations to existing school interior, select exterior wall replacement, roof replacement, and structural roof reinforcing & repairs. The new 74 space Childcare Building will be located on the school proerty off Brock Street. Site redevelopment work includes a new parking lot & drop-off loop serving both Childcare and School, site regrading work, relocation of play structure & baseball backstops and a new play structure.
"RFP CONTACT”
- Verne Reimer Architecture
- Lindsay Forsyth
- Email: lforsyth@vernereimer.com

Dates

Publication

2023/06/14 10:51:06 AM CDT

Bid Intent

Not Available

Questions are submitted online

Closing DateA - Previous Amendment

2023/07/19 02:00:00 PM CDT

Contact Information

Shelley Harrower

204-775-0231 ext. 402

sharrower@wsd1.org

Lindsay Forsyth

lforsyth@vernereimer.com

Bid Security

- Bid Bond

10 %

Bid Submission Process

Bid Submission Type

Electronic Bid Submission

Envelope 1 - Mandatory Technical Submission

Pricing

No pricing in this envelope

Bid Documents List

Item Name	Description	Mandatory	Limited to 1 file
Bid Documents	Documents defining the proposal	Yes	No
No entries

Additional Bidding Instructions

FIRST ENVELOPE TO INCLUDE MANDATORY TECHNICAL REQUIREMENTS + RATED CRITERIA

Envelope 2 - Pricing Submission

Pricing

In attached document

Bid Documents List

Item Name	Description	Mandatory	Limited to 1 file
Bid Documents	Documents defining the proposal	Yes	No
No entries

Additional Bidding Instructions

SECOND ENVELOPE TO INCLUDE PRICING SUBMISSION

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