INGENIUM-21-002-CM - Computerized Maintenance Management System

Deliver one (1) signed original of the Proposal Form / Bid form (within envelope 2
Financial) and of your Technical Proposal (within envelope 1) along with an electronic
version of your Technical Proposal by USB sealed envelope using the "Proposal Label"
provided at Section E for the main envelope. The Proposal must be presented in bound
copies, clearly indicating the name of the Proposal and the Proponent.
The Submission package must be submitted in one main envelope or Package with two separate
sealed envelopes within the package as follows:
a) Envelope 1 Technical Proposal: shall contain one original hard copy of the Proposal
and one electronic copy by USB stick. Refer to Section C 1.3 through Section C 2.0
Rated Requirement for additional details;
b) Envelope 2 Financial Requirements: shall contain the Financial Proposal / bid form
provided in Section D, one original hard copy of the Proposal Bid form and one electronic copy by
USB stick. You should also submit additional pricing sheets to clarify your breakdowns
from the financial proposal. Refer to Section C 2.2 for additional details.
It is the Proponent's responsibility to ensure that all relevant and required information is
included in the submission. Each copy will contain the information requested in this
document.
Deliver Proposals To: Ingenium
Door N-11
1865 St-Laurent Blvd.
Ottawa, Ontario K1G 6M7
Proposals sent by Fax or Other Electronic Means will not be Accepted
Proposals received on or before the stipulated Solicitation Closing Date and time will
become the property of Corporation and will not be returned. All Proposals will be treated as
confidential, subject to the provision of the Access to Information and Privacy Acts.