Information de base

Numéro de référence

0000280471

Organisation émettrice

Simon Fraser University

Organisation propriétaire

Simon Fraser University

Type d’appel d’offres

DDP - Demande de proposition (Formel)

Numéro d’appel d’offres

2024-PD-368

Titre

Vapour Hydrofluoric (VHF) Etching System

Code d’identité d’origine

PU.AC.BC.836081.C83134

Types d’accord

Accord commercial du nouveau partenariat de l’ouest

Accord de libre-échange canadien (ALÉC)

Canada-Union Européenne: Accord économique et commercial Global (AECG)

Détails

Emplacement

Canada, Colombie Britannique, Lower Mainland-Southwest

Point de livraison

8888 University Drive
Burnaby, Colombie Britannique
Canada V5A 1S6

Type d’achat

Une seule fois- Date de livraison:2025-03-31

Description

Description of Deliverables

The RFP invites proposals for the provision of the following equipment:

A Vapour Hydrofluoric (VHF) Etching system

THE DELIVERABLES

4D LABS at Simon Fraser University is acquiring infrastructure to further develop quantum and microsystems-based technologies. The lab is seeking a Vapour Hydrofluoric (VHF) Etching system. The VHF Etching system will be housed in a Class 100 Clean Room facility, alongside a variety of micro- and nanofabrication equipment.

The VHF Etching system should meet the following criteria:

Designed for low-to-medium scale research and development
Flexible to allow for a wide range of materials to be used
Suitable for use in a multi-user facility with low service requirements
Simple to operate

Please provide clear VHF Etching system requirements in the quote, including:

Floor loading
Electrical power supply (e.g., 208V or 120V)
Cooling (pressure, flow, and heat load)
Exhaust
Gases

Mandatory Specifications for VHF Etching system:

Basic Configuration (mandatory, must be included in site acceptance test):

Automated vapour VHF etching system to remove oxides primarily for MEMS release
Complete recipes and process characterization results for high-etch-rate and high-selectivity process options
- Selectivity data requested for the following materials: SiN, Au, Al
System can accommodate pieces, 4” and 6”/150mm wafers with minimal configuration modifications
Rapid change between different wafer sizes or pieces
Ability to process small chips and irregularly shaped substrates
Process data for thermal, LPCVD, PECVD, and Sputtered silicon dioxide
Comprehensive safety systems to operate the system.
Complete software package to operate the system
- Software must include a lifetime license for use and free software upgrades for at least 3 years
1 year parts and labour warranty

Performance Specifications (mandatory):

Condensation-free HF vapour etching
Demonstrated SiO2 etch rate of >0.25um/min for thermal oxide
Undercut (i.e., through etch holes) etch-rate uniformity across a 6” wafer of better than 10%
Ability to control process pressure using a provided dry pump

Optional Specifications for VHF Etching system:

Optional configuration (price separately in Value Add)

System can accommodate 8”/200mm wafers
Process data for doped silicon dioxide layers
2 year parts and labour warranty

Optional Performance Specifications (price separately in Value Add)

Additional process line for alcohol vapour
Lateral etch process monitoring
Vertical etch process monitoring
Ability to process wafers mounted on dicing tape
Precise temperature control of better than 0.5ºC

Consumables (optional, price separately in Supplemental Pricing):

Please provide a cost and approximate lifetime for any consumables necessary to operate the machine. These costs should be separate from the main package price.

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Dates

Publication

2024-10-17 19h10:48 HAP

Intention de soumissionner

Non disponible

Échéance de la réception des questions

2024-10-31 23h59:00 HAP

Questions sont soumises en ligne

Oui

Date de fermeture

2024-11-21 14h00:00 HNP

Information du contact

Paul Dhaliwal

778-782-6840

paul_dhaliwal@sfu.ca

Processus de soumission

Type de soumission

Soumission électronique

Fixation des prix

Dans un document attaché

Liste de documents de la soumission

Nom de l’item	Description	Obligatoire	Limité à un fichier
Appendix B	Submission Form	Oui	Non
Appendix C	Rate Bid Form	Oui	Non
Appendix D	Questions	Oui	Non
Aucune entrée

Directives additionelles d’appel d’offres

Please make note of the following when preparing your proposals:

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