Maskless laser lithography is a technology that incorporates a laser system with dynamic beam management and substrate translation to expose photoresist on a semiconductor substrate for photolithographic patterning. Maskless laser lithography represents a powerful and sustainable alternative to mask-based photolithography. This high-precision, highly flexible technology is ideal for Research and Development (R&D), rapid prototyping, and small-batch production. Maskless laser lithography eliminates the need for photomasks, reducing upfront costs, procurement and design delays - making it particularly advantageous for low- to mid-volume production where design flexibility and quick iteration cycles are critical.
The intention of this tender is to acquire an advanced laser lithography system designed for high precision, maskless lithography tasks that is versatile in accommodating various substrate sizes, tailor-made for research and prototyping endeavors. This tool will be used to perform rapid prototyping of semiconductor devices within the ISO-7 (clean room environment) laboratories of the Advanced Research Center (ARC) at the University of Ottawa. The system must be fully automated, designed for advanced high-resolution lithography and incorporate adjustable writing modes to optimise writing time. The system is expected to be robust, reliable, require low maintenance and incorporate control software that is flexible, user-friendly and accessible for multiple users, including students. The University greatly values extended warranty and the quality of the included elements.
The University is interested in compact models of the instrument, with an ideal footprint of approximately 940 (W) x 1300 (D) x 1650 (H) mm. Additionally, the requirement for wafer size is limited to a maximum of about 4 inches.
Mandatory Technical Requirements:
1. Maskless Laser Lithography System
1.1 Must have optical module wavelength ranging from 360 to 380 nm.
1.2 Must have an optical module power of at least 70 mW
1.3 The optical module must have a lifetime of at least 5000 hr
1.4 The High Resolution Mode must be ≤ 700 nm
1.5 The solution must include a minimum of two resolution modes (high resolution and low resolution)
1.6 The solution must be capable of automated switching between high and low resolution writing modes
1.7 The solution must be capable of automated height adjustments with continuous autofocus
1.8 The solution must include automated software control of the writing process
1.9 The solution must be capable of handling a minimum substrate size of 5 mm X 5 mm
1.10 The solution must be capable of handling a maximum substrate size of 100 mm X 100 mm (4 inch dia. wafers)
1.11 The solution must include two or more beam diameters for high and low resolution writing
1.12 The solution must be capable of accommodating substrates of thickness ranging from 0.250 mm to 3.0 mm
1.13 Max writable area must be ≥ 100 mm x 100 mm
1.14 Top side alignment must have an accuracy of ≤ 250 nm
1.15 The solution must provide support for Graphic Design System II (GDSII) file type
1.16 Overlay accuracy must be ≤ 250 nm
2. Accessories
2.1 Must include an enclosure
2.2 If the proposed system has a tabletop form factor, the supporting table and antivibration platform must be included
2.3 The solution must include a computer capable of running all required software. The solution must also include all necessary peripherals (monitor, keyboard, mouse, etc). Both desktop computers and laptops are acceptable, however it must run on Windows 11 Enterprise or newer. No Operating System (OS) other than Windows will be accepted.
3. Other Requirements
3.1 Must include on-site installation by a qualified engineer.
3.2 Must include on-site training by a qualified engineer for a minimum of four (4) users. The training must also be for a minimum of two (2) business days in length (eight (8) hours per day)
3.3 Must include a minimum of one (1) year of warranty on parts and labour
