Basic Information

Reference Number

0000157895

Issuing Organization

Simon Fraser University

Solicitation Type

RFP - Request for Proposal (Formal)

Solicitation Number

SFU 2019-ES-228

Title

RFP Pick and Place Machine

Source ID

PU.AC.BC.836081.C103284

Agreement Types

Canadian Free Trade Agreement (CFTA)

New West Partnership Trade Agreement (NWPTA)

Details

Location

Canada, British Columbia

Delivery Point

SFU Surrey

Description

This RFP is an invitation to submit offers for the provision of a surface mount technology component placement system (commonly called Pick and Place Machine or P&Ps) for the newly formed WearBioTech facility to produce the next generation of smart interactive wearable devices, as further described in Appendix D – RFP Particulars. This tool will be used by a variety of users and should be capable of placing surface-mount device onto a printed circuit board (PCB) with a high precision positioning for a broad range of electronic components and integrated circuit. The capability to dispense other fluids/materials (e.g. solder paste) onto the PCB is required.

Dates

Publication

2019/08/15 11:32:54 AM PDT

Bid Intent

Not Available

Questions are submitted online

Closing Date

2019/09/16 02:00:00 PM PDT

Contact Information

Eric Sheng

778-782-6869

zlsheng@sfu.ca

Bid Submission Process

Bid Submission Type

Electronic Bid Submission

Pricing

In attached document

Bid Documents List

Item Name	Description	Mandatory	Limited to 1 file
Appendix B	Submission Form	Yes	No
Appendix C	Rate Bid Form	Yes	No
Appendix D	RFP Particulars	Yes	No
No entries

Additional Bidding Instructions

Please respond and follow the format of the appendices provided. If you have any questions, please email Eric Sheng at zlsheng@sfu.ca directly.

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